ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,010, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Microelectronic packages with embedded interposers" was invente... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,011, issued on April 7, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor structure and met... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,012, issued on April 7, was assigned to Hitachi Energy Ltd (Zurich). "Free configurable power semiconductor module" was invented by Juergen... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,013, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Semiconductor packages for stacked memory-on-package (SMOP) and... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,014, issued on April 7, was assigned to POWERTECH TECHNOLOGY INC. (Hsinchu County, Taiwan). "Package device and manufacturing method thereo... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,015, issued on April 7, was assigned to Hyundai Motor Co. (Seoul, South Korea) and Kia Corp. (Seoul, South Korea). "Power module for vehicl... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,016, issued on April 7, was assigned to Dell Products LP (Round Rock, Texas). "Flip chip package" was invented by Qinghong He (Austin, Texa... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,017, issued on April 7, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea). "Package substrate" was invented by Nam Heon Kim (Seoul, ... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,018, issued on April 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure with enhancement ... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,019, issued on April 7, was assigned to Zhuhai ACCESS Semiconductor Co. Ltd. (Guangdong, China). "Embedded packaging structure and manufact... और पढ़ें